AU6638 Bola de Solda de Liga de Estanho Dourado (Au80Sn20)

Gold Tin Alloy Balls (Au80Sn20) Description

Balls exhibit >99% sphericity (diameter tolerance ±10 μm) and surface roughness <0.1 μm Ra. The eutectic composition ensures uniform reflow with minimal intermetallic growth. High thermal conductivity (57 W/m·K) and CTE (14 ppm/°C) match silicon substrates, reducing thermal stress. Oxygen content <100 ppm prevents oxidation during reflow. Applications include 5G RF modules, radiation-hardened FPGAs, and high-brightness LED arrays.

Gold Tin Alloy Balls (Au80Sn20) Applications

·          Gold Tin Alloy Balls (Au80Sn20) are widely used in high-reliability applications such as microelectronics packaging, optoelectronic device assembly, laser diode mounting, and hermetic sealing, where excellent thermal conductivity, mechanical strength, and stable eutectic bonding are critical.

Gold Tin Alloy Balls (Au80Sn20) Packaging

Our products are packaged in customized cartons of various sizes based on the material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We ensure strict adherence to packaging customization and the use of appropriate cushioning materials to provide optimal protection during transportation.

Packaging: Carton, Wooden Box, or Customized.

Kindly review the packaging details provided for your reference.

Manufacturing Process

1.       Testing Method

(1)    Chemical Composition Analysis - Verified using techniques such as GDMS or XRF to ensure compliance with purity requirements.

(2)    Mechanical Properties Testing - Includes tensile strength, yield strength, and elongation tests to assess material performance.

(3)    Dimensional Inspection - Measures thickness, width, and length to ensure adherence to specified tolerances.

(4)    Surface Quality Inspection - Checks for defects such as scratches, cracks, or inclusions through visual and ultrasonic examination.

(5)    Hardness Testing - Determines material hardness to confirm uniformity and mechanical reliability.

Please refer to the SAM testing procedures for detailed information.

Gold Tin Alloy Balls (Au80Sn20) FAQs

Q1. What are the main applications of Au80Sn20 solder balls?

Commonly used in microelectronics, optoelectronics, laser diode packaging, RF components, and hermetic sealing, where high thermal conductivity and mechanical strength are required.

Q2. What is the melting point of Au80Sn20?

The eutectic melting point is approximately 280°C, providing a sharp phase transition for clean and reliable soldering.

Q3. What are the advantages of using Au80Sn20 solder balls?

They offer excellent thermal and electrical conductivity, corrosion resistance, strong mechanical joints, and compatibility with sensitive or high-temperature components.

Performance Comparison Table with Competitive Products

Related Information

1.       Common Preparation Methods

Gold Tin Alloy Balls (Au80Sn20) are typically produced through a precision melting and atomization process. First, high-purity gold and tin are melted together in the eutectic ratio (80 wt% Au, 20 wt% Sn) under an inert or vacuum atmosphere to prevent oxidation. The molten alloy is then rapidly solidified into spherical particles using a gas atomization or droplet formation technique. For high-precision applications, further size classification, sieving, and surface treatment (e.g., oxide removal or passivation) may be performed to ensure uniformity, cleanliness, and excellent bonding performance.