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(Descontinuado) IN6633 Placa de Liga de Índio/prata (In97/Ag 3)

Descontinuado (Descontinuado) IN6633 Placa de Liga de Índio/prata (In97/Ag 3)

Número de catálogo.	IN6633
Material	Em, Ag
Pureza	≥99.9%
Formulário	Placa
Dimensões	Personalizado

Stanford Advanced Materials, uma empresa especializada na pesquisa e produção de materiais avançados, garante que cada um de seus produtos atinja padrões internacionais por meio de um trabalho meticuloso e controle de qualidade rigoroso. O Placa de Liga de Índio/Prata (In97/Ag3) é uma liga altamente dúctil e de baixo ponto de fusão composta por 97% de índio e 3% de prata, oferecendo excepcional condutividade térmica, resistência à oxidação e formabilidade sem emenda para aplicações de precisão em embalagem de semicondutores, selagem criogênica e interconexões em eletrônicos flexíveis.

Produtos Relacionados: Lamina de Liga de Índio/Prata (In97/Ag 3), Lamina/folha/disco de Prata

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Indium/Silver Alloy Plate (In97/Ag 3) Description

The Indium/Silver Alloy Plate (In97/Ag3) is a specialized material composed of 97% indium and 3% silver, engineered to combine the unique properties of both metals. With a low melting point of approximately 157°C, it retains excellent ductility and cold-forming capabilities, allowing it to be shaped into thin, uniform plates or foils without cracking. This alloy exhibits high electrical conductivity (3.3×10⁶ S/m) and thermal conductivity (~80 W/m·K), making it ideal for applications requiring efficient heat dissipation and reliable electrical interconnects, such as thermal interface materials (TIMs) in high-power electronics or solder-free bonding in flexible circuits.

Its oxidation resistance and minimal formation of brittle intermetallic compounds ensure long-term stability in harsh environments, including cryogenic systems and vacuum-sealed devices. The alloy’s ultra-low vapor pressure and compatibility with hermetic sealing processes make it suitable for aerospace components, satellite shielding, and medical device packaging. The spooled plate format enables continuous processing in automated production lines, reducing waste and enhancing efficiency. Additionally, the inclusion of silver enhances mechanical strength while preserving indium’s intrinsic softness, achieving a balance between durability and conformability for precision applications like MEMS (Micro-Electro-Mechanical Systems) and optoelectronic packaging. This alloy’s versatility and reliability underscore its importance in advanced engineering and miniaturized electronic systems.

Indium/Silver Alloy Plate (In97/Ag3) Applications

1. Semiconductor Packaging:

Thermal Interface Materials (TIMs): Acts as a conformable, high-conductivity layer between heat-generating components (e.g., CPUs, GPUs) and heat sinks, reducing thermal resistance in high-power electronics.

Die Attach: Bonds delicate semiconductor dies to substrates without thermal stress, leveraging its low melting point and ductility.

2. Flexible Electronics:

Solder-Free Interconnects: Forms cold-welded joints in flexible circuits, wearable devices, and foldable displays, ensuring durability under repeated bending.

3. Cryogenic Systems:

Seals and Gaskets: Provides leak-tight seals in cryogenic pumps, superconducting magnets, and space satellite components, maintaining integrity at ultra-low temperatures.

4. Aerospace & Defense:

Vacuum-Sealed Components: Used in radar systems, infrared detectors, and vacuum tubes due to its ultra-low outgassing and oxidation resistance.

Radiation Shielding: Enhances protection in satellite components by combining indium’s neutron absorption and silver’s EMI shielding properties.

5. Medical Devices:

Hermetic Encapsulation: Seals implantable devices (e.g., pacemakers) against moisture and bodily fluids, ensuring long-term biocompatibility.

6. Optoelectronics:

LED/Laser Packaging: Serves as a thermal buffer in high-brightness LEDs and laser diodes, preventing overheating and prolonging lifespan.

7. Automotive Electronics:

Power Module Bonding: Joins IGBTs and SiC modules in electric vehicles (EVs), ensuring efficient heat dissipation under high-current loads.

Indium/Silver Alloy Plate (In97/Ag3) Packaging

Our products are packaged in customized cartons of various sizes based on the material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We ensure strict adherence to packaging customization and the use of appropriate cushioning materials to provide optimal protection during transportation.

Packaging: Carton, Wooden Box, or Customized.

Kindly review the packaging details provided for your reference.

Manufacturing Process

1. Testing Method

(1) Chemical Composition Analysis - Verified using techniques such as GDMS or XRF to ensure compliance with purity requirements.

(2) Mechanical Properties Testing - Includes tensile strength, yield strength, and elongation tests to assess material performance.

(3) Dimensional Inspection - Measures thickness, width, and length to ensure adherence to specified tolerances.

(4) Surface Quality Inspection - Checks for defects such as scratches, cracks, or inclusions through visual and ultrasonic examination.

(5) Hardness Testing - Determines material hardness to confirm uniformity and mechanical reliability.

Please refer to the SAM testing procedures for detailed information.

Indium/Silver Alloy Plate (In97/Ag3) FAQs

Q1. What is In97/Ag3 Alloy Plate?

In97/Ag3 is a ductile, low-melting-point alloy composed of 97% indium (In) and 3% silver (Ag), supplied in a continuous spooled plate format for automated manufacturing.

Q2. How is the spooled plate format advantageous?

Automated processing: Enables continuous, high-speed production (e.g., roll-to-roll manufacturing).

Reduced waste: Pre-cut widths/thicknesses (e.g., 0.1-1.0 mm) minimize material loss.

Q3. What are its limitations?

Low mechanical strength: Not suitable for load-bearing applications.

Cost: Higher price than tin-based solders due to indium’s scarcity.

Performance Comparison Table with Competitive Products

Property	In97/Ag3	Pure Indium (In99.99)	In90/Ag10	Pure Silver Ag: 99.99
Melting Point (°C)	157	156	143-160	961
Electrical Conductivity (%IACS)	86	21	75	105
Thermal Conductivity (W/m·K)	80	82	70	429
Elongation (%)	>80	>90	50-70	45
Tensile Strength (MPa)	10-15	4-10	20-30	125-170
Oxidation Resistance	High	Low	Moderate	High
Thermal Expansion Coefficient (ppm/°C)	25	33	24	19.7
Typical Thickness (mm)	0.1-1.0	0.1-2.0	0.2-1.5	0.05-0.3 (foil)
Key Application	Cryogenic seals, TIMs	Low-stress gaskets	Aerospace bonding	High-current interconnects

Related Information

1. Preparation and pretreatment of raw materials

Firstly, high-purity (≥99.99%) Indium (In) and Silver (Ag) metal lumps are selected, which are accurately weighed according to the mass ratio of 97% Indium to 3% Silver. The metal raw materials need to be pre-cleaned to remove surface oxides and contaminants, followed by drying under the protection of inert gas (e.g., argon) to avoid oxidation during the subsequent melting process.

2. Vacuum melting and alloying

Pre-treated indium and silver are placed in a vacuum induction melting furnace and heated under vacuum or inert atmosphere to above the melting point of indium (about 160°C), and then continue to raise the temperature to the melting point of silver (961°C) after the indium is completely melted, and then ensure that the silver is uniformly dissolved in indium by electromagnetic stirring to form a homogeneous In97/Ag3 molten alloy. At this stage, the temperature gradient and stirring time should be strictly controlled to avoid compositional segregation.

3. Casting and Primary Rolling

The molten alloy is rapidly cast into flat ingots or thick plates through water-cooled copper molds to refine the grain structure and reduce shrinkage defects by rapid cooling (cooling rate >50°C/s). Subsequently, the ingot is preheated to 80-100°C and gradually thinned to the target thickness (e.g., 0.1-1.0 mm) by a multi-pass hot rolling process, with the temperature maintained during the rolling process to preserve the ductility of the alloy and prevent cold rolling cracking.

4. Precision cold rolling and annealing

After hot rolling, the plates are cold rolled to further control thickness tolerances (±0.01 mm) and surface finish. During the cold rolling process, the deformation amount per pass is between 10% and 20% to avoid excessive work hardening. Subsequently, intermittent annealing (150-200°C, inert atmosphere) is carried out to remove internal stresses and restore plasticity to ensure subsequent processability.

5. Surface treatment and quality inspection

The rolled plates are electrolytically polished or chemically cleaned to remove surface oxidization and rolling oil residues to obtain a bright, defect-free surface. Composition uniformity is detected by X-ray fluorescence spectroscopy (XRF) to ensure that the silver content is accurately controlled at 3±0.1%. Meanwhile, ultrasonic flaw detector is utilized to check the internal pores or cracks to ensure material densification.

Especificação

Propriedades

Dimensões	Personalizado
Material	In, Ag
Pureza	≥99,9%
Forma	Placa

Composição Química (%)

Elemento	In	Ag
Peso %	97	3

*As informações sobre o produto acima são baseadas em dados teóricos. Para requisitos específicos e consultas detalhadas, favor entrar em contato conosco.

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Descontinuado (Descontinuado) IN6633 Placa de Liga de Índio/prata (In97/Ag 3)

Indium/Silver Alloy Plate (In97/Ag 3) Description

Indium/Silver Alloy Plate (In97/Ag3) Applications

Indium/Silver Alloy Plate (In97/Ag3) Packaging

Manufacturing Process

Indium/Silver Alloy Plate (In97/Ag3) FAQs

Performance Comparison Table with Competitive Products

Related Information

Especificação

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